dowsil 340 heat sink compound pasta odprowadzajaca cieplo Wysoka temperatura_+100°C do 130°C Adhesive sealant for leaks without

Adhesive sealant for leaks without dismantling components

42 DIN 51 350 pt

Class 1 Class 2 Color

Jumping motion

Available in viscosities:

dowsil 340 heat sink compound pasta odprowadzajaca cieplo Wysoka temperatura_+100°C do 130°C Adhesive sealant for leaks withoutDOWSIL 340 Heat Sink Compound Thermal paste White, non flowing, thick mixture with good thermal conductivity Designed for thermal connection of electrical devices and PCB assemblies with radiators Application: Radiators processors and electronic systems PCB assemblies aviation starting and charging batteries boards and components connectors, wiring harnesses thermal paste for cold stores Features and benefits: single component not flowing does not